Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/073764
Kind Code:
A1
Abstract:
A control unit (16) performs: control for performing a scan along a processing path with a first laser beam and forming a cut groove, the processing path following a profile shape of a processed product in the in-plane direction of an upper surface that is the surface of a workpiece irradiated with laser beams; control for stopping the irradiation with the first laser beam when an irradiation position of the laser beam has reached a position before an end section in the processing path; and control for continuing the jetting of a gas over a first standby time period while the irradiation with the first laser beam is stopped. The control unit (16) performs: control for irradiating the workpiece with a second laser beam the thermal energy of which applied to the workpiece per unit time is less than that of the first laser beam; control for causing the second laser beam to maintain a state of radiating the workpiece, over a second standby time period; and control for scanning an uncut region in the processing path with the second laser beam and forming a joint part that couples the processed product and an end material, the thickness of the joint part in the thickness direction of the workpiece being less than the thickness of the workpiece.
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Inventors:
MIYAZAKI TAKANORI (JP)
NAGAI KAZUNORI (JP)
NAGAI KAZUNORI (JP)
Application Number:
PCT/JP2021/039296
Publication Date:
May 04, 2023
Filing Date:
October 25, 2021
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/38
Foreign References:
| JP2012096262A | 2012-05-24 | |||
| JP2001334379A | 2001-12-04 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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