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Title:
LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/129487
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a light-emitting device 2, the method including: a step of removing, from atop a substrate 20, a light-emitting element 24 and a sealing member 26 for sealing the light-emitting element; a step of mounting a light-emitting element 124 in the mounting position of the light-emitting element 24 after removing the light-emitting element 24 and the sealing member 26; and a step of supplying, after mounting the light-emitting element 124, a resin to the inner side of a residue 26a of the sealing member 26 that is left behind on at least a section of the outer perimeter of the sealing member 26 atop the substrate 20, and of using the residue 26a as a dam to form a sealing member 126 that consists of the resin.

Inventors:
KOKETSU MASASHI (JP)
TAKEDA SHIGEO (JP)
SHIMONISHI SHOTA (JP)
Application Number:
PCT/JP2019/044675
Publication Date:
June 25, 2020
Filing Date:
November 14, 2019
Export Citation:
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Assignee:
TOYODA GOSEI KK (JP)
International Classes:
H01L23/28; H01L21/56; H01L33/52; H01L33/56; H01L33/62
Foreign References:
KR20120127852A2012-11-26
JP2016178344A2016-10-06
JP2015181202A2015-10-15
JP2015185682A2015-10-22
JP2010272653A2010-12-02
JP2017034292A2017-02-09
JP2014017375A2014-01-30
JP2014179520A2014-09-25
JP2014130959A2014-07-10
JP2003100816A2003-04-04
JP2007081266A2007-03-29
JPH118338A1999-01-12
JP2002009209A2002-01-11
US20140091344A12014-04-03
US20140103378A12014-04-17
Attorney, Agent or Firm:
HIRATA & PARTNERS (JP)
Download PDF:
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