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Title:
LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/026058
Kind Code:
A1
Abstract:
In a light-emitting device (10), a control circuit (30) controls the lighting-up of a semiconductor light-emitting element (20). A heat-dissipating substrate unit (13) supports the semiconductor light-emitting element (20) and the control circuit (30) so as to recover the heat produced by each. The heat-dissipating substrate unit (13) supports the semiconductor light-emitting element (20) such that a light-emitting part of said semiconductor light-emitting element (20) protrudes farther, in the direction of the main optical axis of said light-emitting part, than the control circuit (30). The heat-dissipating substrate unit (13) comprises: a heat-dissipating substrate (15) that supports the control circuit (30); and a support member (14) that protrudes from the heat-dissipating substrate (15) and supports the semiconductor light-emitting element (20). Said heat-dissipating substrate (15) and support member (14) are formed separately and affixed to each other by an adhesive that has a thermal conductivity of at least 3 W/m∙K.

Inventors:
MATSUMOTO AKIHIRO (JP)
SUZUKI TETSUYA (JP)
NAKAGAWA TOMOYUKI (JP)
SONE NAOKI (JP)
Application Number:
PCT/JP2011/003544
Publication Date:
March 01, 2012
Filing Date:
June 21, 2011
Export Citation:
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Assignee:
KOITO MFG CO LTD (JP)
MATSUMOTO AKIHIRO (JP)
SUZUKI TETSUYA (JP)
NAKAGAWA TOMOYUKI (JP)
SONE NAOKI (JP)
International Classes:
F21S8/10; F21S2/00; F21V19/00; F21V29/00; H01L33/48; F21Y101/02
Foreign References:
JP2010113849A2010-05-20
JP2008262937A2008-10-30
JP2002216525A2002-08-02
JP2004063084A2004-02-26
Attorney, Agent or Firm:
MORISHITA, SAKAKI (JP)
Sakaki Morishita (JP)
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Claims:



 
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