Title:
SEMICONDUCTOR CHIP HAVING HEATER WIRING
Document Type and Number:
WIPO Patent Application WO/2012/026057
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide highly reliable packaging technology for a semiconductor chip. For example, this semiconductor chip is characterised by being provided with: a substrate, a device layer which is formed on one surface of the substrate, heater wiring which radiates heat by radiating electromagnetic waves, and an electrode which is electrically connected to the device layer.
Inventors:
HASEBE TAKEHIKO (JP)
KATO MASAKO (JP)
YAMAGUCHI YOSHIHIDE (JP)
NAKAMURA MASATO (JP)
KASHIMURA TAKASHI (JP)
KATO MASAKO (JP)
YAMAGUCHI YOSHIHIDE (JP)
NAKAMURA MASATO (JP)
KASHIMURA TAKASHI (JP)
Application Number:
PCT/JP2011/003460
Publication Date:
March 01, 2012
Filing Date:
June 17, 2011
Export Citation:
Assignee:
HITACHI LTD (JP)
HASEBE TAKEHIKO (JP)
KATO MASAKO (JP)
YAMAGUCHI YOSHIHIDE (JP)
NAKAMURA MASATO (JP)
KASHIMURA TAKASHI (JP)
HASEBE TAKEHIKO (JP)
KATO MASAKO (JP)
YAMAGUCHI YOSHIHIDE (JP)
NAKAMURA MASATO (JP)
KASHIMURA TAKASHI (JP)
International Classes:
H01L21/60; H01L21/3205; H01L21/822; H01L23/52; H01L25/065; H01L25/07; H01L25/18; H01L27/04
Foreign References:
| JP2008277798A | 2008-11-13 | |||
| JPH10325761A | 1998-12-08 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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Claims: