Title:
MACHINING APPARATUS FOR DIAMOND CUTTING TOOL
Document Type and Number:
WIPO Patent Application WO/2013/047604
Kind Code:
A1
Abstract:
Provided is a machining apparatus for a diamond cutting tool whereby high contour-precision polishing can be carried out more simply than in the prior art. A machining apparatus (100) for a diamond cutting tool is provided with: a pedestal part (α); a holding mechanism (β) that is provided atop the pedestal part (α), is held by a polishing target holding arm having a rough diamond, and that is reciprocatingly rotated about a Y-axis; and a polishing mechanism (γ) that is provided atop the pedestal part (α) and is for polishing the rough diamond using a polishing surface (5s) rotated about a Z-axis. The polishing mechanism (γ) of the machining apparatus (100) is provided with: a rotating polisher (5) including the polishing surface (5s); and a vertical motion mechanism unit on the polishing surface side, for vertically moving the polishing surface (5s) in the Z-axis direction with respect to the rough diamond.
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Inventors:
NISHIMURA KAZUHITO (JP)
SASAOKA HIDEKI (JP)
SASAOKA HIDEKI (JP)
Application Number:
PCT/JP2012/074748
Publication Date:
April 04, 2013
Filing Date:
September 26, 2012
Export Citation:
Assignee:
KOCHI FEL CO LTD (JP)
International Classes:
B24B3/34; B24B9/16
Foreign References:
| JPH01146649A | 1989-06-08 | |||
| JPH11114819A | 1999-04-27 | |||
| JPS61121874A | 1986-06-09 | |||
| JPS61159357A | 1986-07-19 | |||
| JPH03190607A | 1991-08-20 |
Attorney, Agent or Firm:
YAMANO, HIROSHI (JP)
Hiroshi Yamano (JP)
Hiroshi Yamano (JP)
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Claims: