Title:
MATERIAL FOR LAMINATION MOLDING, PRODUCTION METHOD FOR MOLD USING POWDER FIXING LAMINATION METHOD, AND MOLD
Document Type and Number:
WIPO Patent Application WO/2016/075845
Kind Code:
A1
Abstract:
A mold material, being one example of this material for lamination molding, comprises: a first alumina sand and a second alumina sand that serve as aggregates; and an alumina cement that serves as a binder. The first alumina sand and the second alumina sand are both white inductive alumina comprising an aluminum oxide (Al2O3) having a purity of at least 99% and both are heat resistant to at least 1,500°C. In addition, the first alumina sand comprises particles having a central particle diameter of 45-53 µm. Furthermore, the second alumina sand comprises particles having a central particle diameter of 75-106 µm.
Inventors:
FUJIYAMA KOJIRO (JP)
HIRATSUKA SADATO (JP)
HIRATSUKA SADATO (JP)
Application Number:
PCT/JP2014/084074
Publication Date:
May 19, 2016
Filing Date:
December 24, 2014
Export Citation:
Assignee:
TAKATORI SEISAKUSHO CO LTD (JP)
International Classes:
B22C9/02; B22D18/04
Domestic Patent References:
| WO2013054833A1 | 2013-04-18 | |||
| WO2011013730A1 | 2011-02-03 |
Foreign References:
| JP2012045574A | 2012-03-08 |
Attorney, Agent or Firm:
ARIYOSHI Shuichiro et al. (JP)
Shuichiro Ariyoshi (JP)
Shuichiro Ariyoshi (JP)
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