Title:
METAL POWDER, INK, SINTERED COMPACT, AND SUBSTRATE FOR PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING METAL POWDER
Document Type and Number:
WIPO Patent Application WO/2016/121749
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a metal powder and an ink whereby a sintered compact having excellent flexibility can be formed, and a sintered compact having excellent flexibility. The metal powder pertaining to an embodiment of the present invention has an average particle diameter D50BET calculated by a BET method of 1 nm to 200 nm, an average crystallite diameter DCryst measured by X-ray analysis of 20 nm or less, and a ratio (DCryst/D50BET) of the average crystallite diameter DCryst to the average particle diameter D50BET of less than 0.4. The main component of the metal powder is preferably copper or a copper alloy. The metal powder is preferably formed by a liquid-phase reduction method whereby metal ions are reduced by a reducing agent in an aqueous solution. Trivalent titanium ions are preferably used as the reducing agent in the liquid-phase reduction method. The ink pertaining to an embodiment of the present invention is provided with the metal powder and a dispersion medium for the same. The sintered compact pertaining to an embodiment of the present invention is formed by applying the abovementioned ink and sintering the product, and has an average crystallite diameter DCryst of 25 nm or less.
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Inventors:
OKADA ISSEI (JP)
OKA YOSHIO (JP)
KASUGA TAKASHI (JP)
OKUDA YASUHIRO (JP)
PARK JINJOO (JP)
MIURA KOUSUKE (JP)
UEDA HIROSHI (JP)
OKA YOSHIO (JP)
KASUGA TAKASHI (JP)
OKUDA YASUHIRO (JP)
PARK JINJOO (JP)
MIURA KOUSUKE (JP)
UEDA HIROSHI (JP)
Application Number:
PCT/JP2016/052159
Publication Date:
August 04, 2016
Filing Date:
January 26, 2016
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
International Classes:
B22F1/00; B22F7/04; B22F9/24; H01B1/00; H01B1/22; H01B5/00; H01B5/14; H01B13/00; C22C9/00
Domestic Patent References:
| WO2014080662A1 | 2014-05-30 | |||
| WO2014162821A1 | 2014-10-09 |
Foreign References:
| JP2013028859A | 2013-02-07 | |||
| US6045925A | 2000-04-04 | |||
| JP2010275578A | 2010-12-09 | |||
| JP2012172170A | 2012-09-10 | |||
| JP2015168878A | 2015-09-28 |
Attorney, Agent or Firm:
AMANO KAZUNORI (JP)
Kazuki Amano (JP)
Kazuki Amano (JP)
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