Title:
COPPER PASTE
Document Type and Number:
Japanese Patent JP2022120411
Kind Code:
A
Abstract:
To provide a copper paste that shows excellent oxidation resistance, has excellent electrical conductivity, thermal conductivity, and storage stability, and expresses high joint strength.SOLUTION: Provided is a copper paste containing a copper powder and an organic solvent, wherein the organic solvent is an alcohol-based solvent containing one or more first alcohols selected from the group consisting of monohydric and dihydric alcohols having a viscosity at 20°C of 3-70 mPa s, and one or more second alcohols selected from the group consisting of dihydric and trihydric alcohols having a viscosity at 20°C of 300-1000 mPa s.SELECTED DRAWING: None
Inventors:
KOIKE JUNICHI
Application Number:
JP2021017286A
Publication Date:
August 18, 2022
Filing Date:
February 05, 2021
Export Citation:
Assignee:
MAT CONCEPT INC
International Classes:
H01B1/22; B22F1/00; B22F1/102; B22F9/00; C09C1/00; C09C3/08; C09C3/10; C09D17/00; C22C9/00; C22F1/08; H01B1/00
Attorney, Agent or Firm:
Mitsuru Iwaike
Akihiro Kitamura
Akihiro Kitamura
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