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Title:
METHOD FOR CLEANING TREATMENT CHAMBER IN SUBSTRATE TREATING APPARATUS AND METHOD FOR DETECTING ENDPOINT OF CLEANING
Document Type and Number:
WIPO Patent Application WO/2005/081302
Kind Code:
A1
Abstract:
A method for cleaning a treatment chamber in a substrate treating apparatus for subjecting a substrate having a tungsten-based coating film to a plasma treatment, which comprises introducing a gas containing O2 into the treatment chamber after the plasma treatment without opening the chamber to the atmosphere, to thereby form the plasma of the gas and clean the treatment chamber.

Inventors:
OZAKI SHIGENORI (JP)
NOGUCHI HIDEYUKI (JP)
KABE YOSHIRO (JP)
ISA KAZUHIRO (JP)
SASAKI MASARU (JP)
Application Number:
PCT/JP2005/002394
Publication Date:
September 01, 2005
Filing Date:
February 17, 2005
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
OZAKI SHIGENORI (JP)
NOGUCHI HIDEYUKI (JP)
KABE YOSHIRO (JP)
ISA KAZUHIRO (JP)
SASAKI MASARU (JP)
International Classes:
B08B7/00; C23C16/44; C23C16/52; H01J37/32; H01L21/3065; H01L21/31; (IPC1-7): H01L21/31; C23C16/44; H01L21/3065
Foreign References:
JP2001250818A2001-09-14
JP2001127280A2001-05-11
JPH09249975A1997-09-22
JPH0892769A1996-04-09
JP2000294550A2000-10-20
JP2001015398A2001-01-19
JPH05102089A1993-04-23
Attorney, Agent or Firm:
Takayama, Hiroshi (Shin-Yokohama IC Building 18-9, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-sh, Kanagawa 33, JP)
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