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Title:
METHOD FOR DEBURRING CORE MEMBERS OF ELECTRONIC COMPONENTS, AND DEVICE THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/105301
Kind Code:
A1
Abstract:
Provided are a method for reliably deburring members of small electronic components in large quantities at a time so as not to cause cracking and chipping in the members, and a device therefor. A deburring method for removing protrusion-shaped burrs generated in gaps between a plurality of flanges of a core member produced from bulk ceramics and provided with the plurality of flanges. First, a large number of core members are put into a closed-end cylindrical tumbler having an opening at one end and closed at the other end. Then, the large number of core members are stirred by rotating the tumbler. A jet of gas in which injection materials smaller than the gaps between the flanges is mixed is injected toward the protrusion-shaped burrs generated in the gaps between the plurality of flanges of at least the core members through the opening. Thereafter, the injection materials are discharged to the outside of the tumbler through a through-hole provided in the wall surface of the tumbler.

Inventors:
SAKAI SHIGEKAZU (JP)
Application Number:
PCT/JP2012/072855
Publication Date:
July 18, 2013
Filing Date:
September 07, 2012
Export Citation:
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Assignee:
SINTOKOGIO LTD (JP)
SAKAI SHIGEKAZU (JP)
International Classes:
B24C1/00; B24C1/04; B24C3/28; B24C3/32; B24C11/00
Domestic Patent References:
WO2011024613A12011-03-03
Foreign References:
JPH04176564A1992-06-24
JP2007260874A2007-10-11
JP2003080459A2003-03-18
JP2004209604A2004-07-29
JP2010149204A2010-07-08
Attorney, Agent or Firm:
YAMASAKI, Yukuzo et al. (JP)
Yukuzo Yamazaki (JP)
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Claims: