METHOD AND DEVICE FOR ANALYZING LAYING CONDITION OF WIRE

WIPO Patent Application WO/2010/125713

A1

Provided are a method and a device for automatically analyzing laying conditions of wires such as optical fibers. An image of a laid optical fiber (20) is captured by a camera (51). The optical fiber (20) has position marks (23) each indicating a distance from a predetermined position and the direction of the optical fiber (20) formed at regular intervals. The captured image is processed at a laying condition analyzing device (52), and the laying condition of the optical fiber (20) is analyzed using optical fiber laying tools (40) and the position marks (23). The laying condition of the optical fiber (20) is associated with rectangular coordinates so that coordinates of any position of the optical fiber (20) can be calculated using, for example, a distance from an inlet portion of a cassette (10).

UNO KAZUSHI (JP)
TAKEI FUMIO (JP)
KASAJIMA TAKEO (JP)

PCT/JP2009/071313

November 04, 2010

December 22, 2009

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FUJITSU LTD (JP)
UNO KAZUSHI (JP)
TAKEI FUMIO (JP)
KASAJIMA TAKEO (JP)

G01B11/00; H02G1/06; G01B21/00; G01K11/12; G02B6/00

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JP2007318415A	2007-12-06
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JPS62110160A	1987-05-21
JPH0712655A	1995-01-17
JPH02123304A	1990-05-10
JP2002267242A	2002-09-18
JPH0511840A	1993-01-22
JPH0989529A	1997-04-04
JP2008282123A	2008-11-20

"Fujitsu Develops Technology Enabling Real-time Multiple-Point Temperature Measurement", 4 April 2008, FUJITSU LABORATORIES LTD.

OKAMOTO, KEIZO (JP)
Keizo Okamoto (JP)

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