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Title:
METHOD OF MANUFACTURING BACKLIGHT MODULE
Document Type and Number:
WIPO Patent Application WO/2018/120849
Kind Code:
A1
Abstract:
A method of manufacturing a backlight module. The method comprises: providing a light guide plate (710) comprising a bottom surface and a plurality of lattice point depressions (714) arranged in a two dimensional arrangement, wherein the lattice point depressions (714) are located at the bottom surface; filling each of the lattice point depressions (714) with a quantum dot material (716); arranging a substrate (712) on the bottom surface of the light guide plate (710), and utilizing the substrate (712) to seal the quantum dot material (716) inside the lattice point depressions (714) of the light guide plate (710), and arranging a light source at one side of the light guide plate (710).

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Inventors:
LEE CHIA-HANG (CN)
Application Number:
PCT/CN2017/097481
Publication Date:
July 05, 2018
Filing Date:
August 15, 2017
Export Citation:
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Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
G02F1/13357; G02B6/00
Foreign References:
CN105929480A2016-09-07
CN106597746A2017-04-26
CN72769A
CN206114945U2017-04-19
KR20130024152A2013-03-08
Attorney, Agent or Firm:
BEIJING HUIZE INTELLECTUAL PROPERTY LAW LLC (CN)
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