Title:
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/059572
Kind Code:
A1
Abstract:
A method for manufacturing an electronic device according to the present invention includes in the following order: a step (A) for preparing a structure (60) including a half-diced electronic component (10) having a circuit forming surface (10A), and an adhesive laminate film (50) which has a base layer and an adhesive resin layer (40), the adhesive resin layer (40) side adhered on the circuit forming surface (10A) of the electronic component (10) so as to protect the circuit forming surface (10A); a step (B) for back-grinding the opposite surface to the circuit forming surface (10A) of the electronic component (10); a step (C) for performing a full-dicing on the electronic component (10); and a step (D) for forming an electromagnetic wave shielding layer (70) on the segmented pieces of the electronic component (10), wherein, in the step (A), the step (B), the step (C), and the step (D), the same adhesive laminate film is used as the adhesive laminate film (50).
Inventors:
UNEZAKI TAKASHI (JP)
KAMADA JUN (JP)
MORIMOTO AKIMITSU (JP)
KINOSHITA JIN (JP)
KAMADA JUN (JP)
MORIMOTO AKIMITSU (JP)
KINOSHITA JIN (JP)
Application Number:
PCT/JP2019/035524
Publication Date:
March 26, 2020
Filing Date:
September 10, 2019
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
H01L23/00; H01L21/301
Domestic Patent References:
| WO2018143014A1 | 2018-08-09 | |||
| WO2018092446A1 | 2018-05-24 |
Foreign References:
| JP2003179005A | 2003-06-27 | |||
| JP2008016606A | 2008-01-24 | |||
| JP2015218287A | 2015-12-07 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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