Title:
METHOD FOR PRODUCING PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/189300
Kind Code:
A1
Abstract:
The present invention provides a method for producing a printed wiring board with a built-in capacitor, the printed wiring board exhibiting excellent adhesion between a circuit and a dielectric layer, with high productivity, while reducing the risk of breakage of a resin layer and easily controlling the thickness of a dielectric layer. This method for producing a printed wiring board with a built-in capacitor comprises: superposition of a copper foil with a carrier comprising a carrier, a release layer and a first copper layer on at least one surface of a first resin base material such that the carrier is in contact with the first resin base material; formation of a circuit on the first copper layer; superposition of a copper-clad laminate comprising a second resin base material and a second copper layer on the above-obtained circuit on the multilayer body such that the circuit is embedded in the second resin base material; achievement of an embedded circuit board by separating the first resin base material and the carrier from the first copper layer and removing the first copper layer by etching; superposition of the embedded circuit board on a copper foil with resin comprising a copper layer and a resin layer that is composed of a semi-cured resin which has a maximum value of the logarithmic decrement of 0.02 or more; and formation of a dielectric layer that has a thickness of 30 µm or less by curing the semi-cured resin.
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Inventors:
YONEDA YOSHIHIRO (JP)
HOSOI TOSHIHIRO (JP)
FUKUDA KENSHIRO (JP)
KAGEYAMA YUJI (JP)
IIDA HIROTO (JP)
HOSOI TOSHIHIRO (JP)
FUKUDA KENSHIRO (JP)
KAGEYAMA YUJI (JP)
IIDA HIROTO (JP)
Application Number:
PCT/JP2023/008661
Publication Date:
October 05, 2023
Filing Date:
March 07, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H05K3/46; H01G4/18; H01G4/33; H05K1/16
Domestic Patent References:
| WO2006016586A1 | 2006-02-16 | |||
| WO2017085849A1 | 2017-05-26 | |||
| WO2009008471A1 | 2009-01-15 |
Foreign References:
| JP2019014118A | 2019-01-31 | |||
| JP2010036350A | 2010-02-18 | |||
| JP2003243795A | 2003-08-29 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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