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Title:
MICRO-LED DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2023/108781
Kind Code:
A1
Abstract:
The present invention provides a micro-LED display module and a manufacturing method therefor, and a display panel. The manufacturing method comprises: first, respectively coating a first substrate and a second substrate to form a first photoresist layer and a second photoresist layer, the first photoresist layer and the second photoresist layer being used for protection, and more importantly, manufacturing a first gap between a first chip electrode and a first driving electrode during bonding; then forming a first bonding layer in the first gap between the first chip electrode and the first driving electrode by means of a chemical plating method. Moreover, also provided is a method for bonding a positive electrode and a negative electrode to LED chips on two sides and the first substrate and a third substrate respectively, such that the positive electrode and the negative electrode are further prevented from being interconnected due to the coating in the chemical plating process. The present invention adopts a chemical plating method, which does not need to apply external pressure during bonding or carry out welding through heating, the yield and reliability during bonding are improved, and then the stability and the service life of the micro-LED display module are improved.

Inventors:
MA GANG (CN)
Application Number:
PCT/CN2021/140743
Publication Date:
June 22, 2023
Filing Date:
December 23, 2021
Export Citation:
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Assignee:
XIAMEN EXTREMELY PQ DISPLAY TECH CO LTD (CN)
International Classes:
H01L27/15; H01L25/075
Domestic Patent References:
WO2020238099A12020-12-03
WO2019013469A12019-01-17
Foreign References:
CN113539852A2021-10-22
CN112928194A2021-06-08
CN113540003A2021-10-22
US20190371229A12019-12-05
Attorney, Agent or Firm:
SHENZHEN JINGZHI INTELLECTUAL PROPERTY AGENCY CO. LTD (CN)
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