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Title:
MICRONEEDLE ARRAY, MICRONEEDLE ARRAY ASSEMBLY, AND TEST CHIP
Document Type and Number:
WIPO Patent Application WO/2022/118859
Kind Code:
A1
Abstract:
This microneedle array has a substrate and at least one solid microneedle. The substrate has a first main surface, a second main surface facing the first main surface, and at least one through-hole that penetrates from the first main surface to the second main surface. The microneedle projects from the first main surface.

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Inventors:
MITAMURA TAKENORI (JP)
KURIHARA MAI (JP)
Application Number:
PCT/JP2021/043960
Publication Date:
June 09, 2022
Filing Date:
November 30, 2021
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
A61M37/00; A61B5/151; A61B5/157
Domestic Patent References:
WO2019176126A12019-09-19
WO2019188164A12019-10-03
Foreign References:
CN209917068U2020-01-10
US20200229803A12020-07-23
JP2005514179A2005-05-19
JP2005246054A2005-09-15
JP2013090808A2013-05-16
JP2004065775A2004-03-04
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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