Title:
MICROPHONE ASSEMBLY WITH JFET FLIP-CHIP BUFFER FOR HEARING AID
Document Type and Number:
WIPO Patent Application WO2001050814
Kind Code:
A8
Abstract:
A hearing aid microphone module housing all the electronic components needed for a functional hearing aid other than the battery and receiver is described which uses flip-chip technology to couple a JFET buffer to the components. The buffer is disposed on a PCB which defines a back volume of the housing.
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Inventors:
MADAFFARI PETER
SJURSEN WALTER P
POUX CHRISTOPHER
MORONEY RICHARD
PALANISAMY PONNUSAMY
SJURSEN WALTER P
POUX CHRISTOPHER
MORONEY RICHARD
PALANISAMY PONNUSAMY
Application Number:
PCT/US2000/000252
Publication Date:
December 27, 2001
Filing Date:
January 06, 2000
Export Citation:
Assignee:
SARNOFF CORP (US)
TIBBETTS INDUSTRIES (US)
TIBBETTS INDUSTRIES (US)
International Classes:
H04R19/01; H04R25/00; (IPC1-7): H04R25/00; H04R19/01
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