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Patent Searching and Data


Title:
MICROWAVE HEATING DEVICE AND MICROWAVE HEATING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/058379
Kind Code:
A1
Abstract:
[Problem] To provide a microwave heating device and a microwave heating method whereby it is possible to appropriately heat either a film of a conductor or semiconductor or a film of a dispersion in which a conductor or semiconductor has been dispersed. [Solution] Microwaves in a wavelength range of 1 m to 1 mm are supplied to a waveguide tube (16a), and a substrate (24), on which is formed either a film of a conductor or semiconductor or a film of a dispersion in which a conductor or semiconductor has been dispersed, is placed or moved inside the waveguide tube (16a) so that the surface on which the film is formed is substantially parallel to the direction of the electric force lines of the microwaves.

Inventors:
UCHIDA HIROSHI (JP)
SHINOZAKI KENJI (JP)
SENDA KAZUAKI (JP)
Application Number:
PCT/JP2012/077149
Publication Date:
April 25, 2013
Filing Date:
October 19, 2012
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
FUJI ELECTRONIC IND CO LTD (JP)
International Classes:
H05K3/12; H01L21/28; H01L21/288; H01L21/31; H05B6/74; H05B6/78
Domestic Patent References:
WO2003036700A12003-05-01
Foreign References:
JP2009283547A2009-12-03
JPH0574592A1993-03-26
JPH0821787A1996-01-23
JP2002203844A2002-07-19
JP2008146966A2008-06-26
JP2009177149A2009-08-06
JP2004235562A2004-08-19
JPH01122123A1989-05-15
JPH06287761A1994-10-11
JPH05299387A1993-11-12
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
Motoji Arihara (JP)
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Claims: