Title:
ADHESIVE COMPOSITION, CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/058380
Kind Code:
A1
Abstract:
An adhesive composition of the present invention contains a resin composition and a plurality of conductive particles, and when the maximum diameter in the particle size distribution of the conductive particles is represented by a and the minimum diameter is represented by b, the ratio of the maximum diameter a to the minimum diameter b, namely a/b is 5.0 or more. A cured product obtained by heating the adhesive composition at 180˚C for 40 seconds has a storage modulus at 40˚C of 1.0 GPa or less and a storage modulus at 200˚C of 3.0 MPa or more.
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Inventors:
ISHIDA YASUHISA (JP)
FUJINAWA TOHRU (JP)
MATSUDA KAZUYA (JP)
YANAGAWA TOSHIYUKI (JP)
FUJIEDA TADAYASU (JP)
FUJINAWA TOHRU (JP)
MATSUDA KAZUYA (JP)
YANAGAWA TOSHIYUKI (JP)
FUJIEDA TADAYASU (JP)
Application Number:
PCT/JP2012/077150
Publication Date:
April 25, 2013
Filing Date:
October 19, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J7/00; C09J9/02; H01B1/22; H01L21/60; H01R11/01; H05K1/14; H05K3/36
Foreign References:
| JP2002322456A | 2002-11-08 | |||
| JP2009256466A | 2009-11-05 | |||
| JPH11241054A | 1999-09-07 | |||
| JP2011068913A | 2011-04-07 | |||
| JP2003176473A | 2003-06-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: