MOLDING MOLD, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE

WIPO Patent Application WO/2024/004241

A1

Provided are a molding mold, a resin molding device, and a method for manufacturing a resin molded article that enable the prevention of resin leakage.　A molding die (1000) is used in compression molding, and comprises a first die (200) and a second die (100) that are arranged facing each other. The first die (200) is provided with a die main surface member (202) constituting a main surface serving as a bottom surface or a top surface of a die cavity (204), and die lateral surface members (201) constituting lateral surfaces of the die cavity (204). The die cavity (204) is formed by a space enclosed by the die main surface member (202) and the die lateral surface members (201). A resin material (20) can be accommodated inside the die cavity (204). The die lateral surface members (201) are capable of moving up and down relative to the die main surface member (202). The die lateral surface members (201) each have elastic members (203a) and (203b) which are arranged on an opposite side to a side facing the second die (100). The elastic members (203a) and (203b) are arranged so as to be capable of partially differentiating a state in which a force is applied along a planar-shaped outer periphery of the die cavity (204).

YAGI TOSHIHIRO (JP)

PCT/JP2023/001959

January 04, 2024

January 23, 2023

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TOWA CORP (JP)

B29C33/10; B29C33/20; B29C43/34; B29C43/36

JP2019136942A	2019-08-22
JP2017092220A	2017-05-25
JP2015214063A	2015-12-03

TSUJIMARU Koichiro et al. (JP)

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