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Title:
THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE GREASE AND THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2024/004242
Kind Code:
A1
Abstract:
This thermally conductive resin composition contains a matrix resin and thermally conductive particles. The thermally conductive particles contain: thermally conductive particles A, which have been surface treated in advance with a surface treatment agent having an aromatic hydrocarbon group; and thermally conductive particles B, which have been surface treated in advance with a surface treatment agent having an aliphatic hydrocarbon group. The thermally conductive particles A and/or thermally conductive particles B are preferably at least one type of inorganic particles selected from the group consisting of plate-like particles and polyhedral particles. Provided by this configuration are a thermally conductive composition, a thermally conductive grease and a thermally conductive sheet which have an appropriate viscosity and high thermal conductivity and in which a decrease in the steady state value of compressive load is suppressed.

Inventors:
IWAI MAKOTO
HATTORI MASAKAZU
Application Number:
PCT/JP2023/001993
Publication Date:
January 04, 2024
Filing Date:
January 24, 2023
Export Citation:
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Assignee:
FUJI POLYMER IND (JP)
International Classes:
C08L101/00; C08K3/01; C08K5/5415; H01L23/373
Domestic Patent References:
WO2022049817A12022-03-10
WO2022049816A12022-03-10
Foreign References:
JP6988023B12022-01-05
JPH11209618A1999-08-03
JP2021021047A2021-02-18
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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