MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

WIPO Patent Application WO/2012/137457

A1

In a constitution such that a first mounting substrate on which a semiconductor element is joined and mounted by soldering is mounted on a second substrate, the connection strength is low if the first mounting substrate is joined to the second substrate using solder with a low melting point. This mounting structure has a first mounting substrate (5), to which a semiconductor element (4) is joined by a first solder (1) having a melting point of 217°C or greater, and is mounted on a second substrate (8). Provided are joining parts (6) formed from a plurality that joins the first mounting substrate and the second substrate and reinforcing members (7) formed around each of the various joining parts. The joining parts include a second solder having a melting point lower than the first solder (1) and are constituted so as to have a space (16) between the reinforcing members formed on each of the adjacent joining parts.

YAMAGUCHI ATSUSHI
YOSHIDA HISAHIKO
KISHI ARATA
OHASHI NAOMICHI

PCT/JP2012/002255

October 11, 2012

April 02, 2012

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PANASONIC CORP (JP)
YAMAGUCHI ATSUSHI
YOSHIDA HISAHIKO
KISHI ARATA
OHASHI NAOMICHI

H05K1/14; H01L21/60; H05K3/34; H05K3/36

JP2009099963A	2009-05-07
JPH06268365A	1994-09-22
JP2005235819A	2005-09-02
JP2003059970A	2003-02-28
JP2007134476A	2007-05-31
JP4135268B2	2008-08-20
JP2011018741A	2011-01-27
JP2009155431A	2009-07-16
JP2001035966A	2001-02-09
JP2004103928A	2004-04-02
JP2002176248A	2002-06-21
JP2005064303A	2005-03-10
JP2004274000A	2004-09-30
JP2002334903A	2002-11-22

TOKKYOGYOMUHOUJIN MATSUDAKOKUSAITOKKYOJIMUSYO (JP)
Patent business corporation Matsuda international patent firm (JP)

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