Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/024193
Kind Code:
A1
Abstract:
In a multilayer ceramic electronic component, the present invention mitigates the effect of thermal stress caused by solder shrinkage while suppressing an increase in a dimensions of the component. This multilayer ceramic electronic component 10 according to the present invention comprises: a multilayer body 12; a first external electrode 30a provided across from a first end surface 12e of the multilayer body 12 to each of a first principal surface 12a and a second principal surface 12b; and a second external electrode 30b provided across from a second end surface 12f of the multilayer body 12 to each of the first principal surface 12a and the second principal surface 12b, wherein the first external electrode 30a has a first principal surface inclined section 35ma that is formed across from the first principal surface 12a side to the first end surface 12e side of the multilayer body 12, the second external electrode 30b has a second principal surface inclined section 37ma that is formed across from the first principal surface 12a side to the second end surface 12f side of the multilayer body 12, the first principal surface inclined section 35ma covers a ridge section formed by the first principal surface 12a and the first end surface 12e of the multilayer body 12, and the second principal surface inclined section 37ma covers a ridge section formed by the first principal surface 12a and the second end surface 12f of the multilayer body 12.
Inventors:
TOMINAGA KEN (JP)
Application Number:
PCT/JP2023/016532
Publication Date:
February 01, 2024
Filing Date:
April 26, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Foreign References:
| JPH02111005A | 1990-04-24 | |||
| JP2021174793A | 2021-11-01 | |||
| JP2017022365A | 2017-01-26 | |||
| JPS57128131U | 1982-08-10 | |||
| JP2019186295A | 2019-10-24 | |||
| JP2016086063A | 2016-05-19 |
Attorney, Agent or Firm:
OKADA, Masahiro (JP)
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