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Patent Searching and Data


Title:
MANUFACTURING METHOD FOR LIGHT EMITTING DEVICE, AND BLACK TRANSFER FILM
Document Type and Number:
WIPO Patent Application WO/2024/024192
Kind Code:
A1
Abstract:
A manufacturing method for a light emitting device that has a black matrix in at least a portion of the periphery of light emitting elements that are positioned on a wiring board, said manufacturing method having: (step a) a step in which a black transfer film that has a black transfer layer formed on one surface of a light-transmissive substrate is made to face, from the black transfer layer side, the wiring board before the light emitting elements are positioned thereon; (step b) a step in which a laser is shined on the light-transmissive substrate side of the black transfer film, thereby transferring individual pieces of the black transfer layer to locations on the wiring board where the light emitting elements will be positioned; and (step c) a step in which the light emitting elements are positioned on the individual pieces of the black transfer layer that were transferred onto the wiring board, and the light emitting elements are mounted, thereby deforming the black transfer layer to form a black matrix in at least a portion of the periphery of the light emitting elements and connecting the light emitting elements to the wiring board.

Inventors:
TSUKAO REIJI (JP)
HAYASHI NAOKI (JP)
NODA DAIKI (JP)
WATANABE KAZUMU (JP)
SHIRAIWA TOSHIKI (JP)
Application Number:
PCT/JP2023/016379
Publication Date:
February 01, 2024
Filing Date:
April 26, 2023
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
G09F9/30; G09F9/00; G09F9/33; H01L21/60; H01L33/52; H01L33/56; H01L33/62
Domestic Patent References:
WO2019031183A12019-02-14
Foreign References:
JP2020043140A2020-03-19
JP2020502550A2020-01-23
JP2020092159A2020-06-11
JP2006084908A2006-03-30
JP2016027668A2016-02-18
US20110315989A12011-12-29
US20200303585A12020-09-24
US20200373473A12020-11-26
US20210091138A12021-03-25
US20210111324A12021-04-15
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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