Title:
SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND DEVICE MANUFACTURING
Document Type and Number:
WIPO Patent Application WO/2024/024191
Kind Code:
A1
Abstract:
A substrate processing system for processing a polymer substrate formed by laminating a first substrate, an interface layer that includes at least a laser-absorbing layer, and a second substrate, wherein: the substrate processing system comprises a laser radiation unit that irradiates the laser-absorbing layer with pulsed laser light, and a control unit; and the control unit allows the first substrate or the interface layer to expand due to heat produced by irradiating the laser-absorbing layer with the laser light and controls irradiation of the laser light in the laser radiation unit such that peeling occurs at the interface between the first substrate and the laser-absorbing layer, or at the interface between the interface layer and the laser-absorbing layer, due to stress produced by the expansion.
Inventors:
YAMASHITA YOHEI (JP)
Application Number:
PCT/JP2023/016356
Publication Date:
February 01, 2024
Filing Date:
April 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; B23K26/18; B23K26/57; H01L21/301
Domestic Patent References:
| WO2021192854A1 | 2021-09-30 | |||
| WO2021192853A1 | 2021-09-30 |
Foreign References:
| JP2007220749A | 2007-08-30 | |||
| JP2022091504A | 2022-06-21 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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