Title:
NON-CONTACT TYPE INFRARED TEMPERATURE SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2017/209349
Kind Code:
A1
Abstract:
A non-contact type infrared temperature sensor module according to an embodiment of the present invention can comprise: a case of which a portion of an upper surface is opened and having an accommodation space formed therein; a base having an upper surface coupled to the case; a cover window provided on the upper surface of the case and sealing the opened portion of the case; an infrared temperature sensor provided on the upper surface of the base and sensing the temperature of an object by receiving light transmitted from the cover window; and a first capping part coupled to an upper portion of the infrared temperature sensor and blocking heat transmitted from the accommodation space.
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Inventors:
NAM HYOJIN (KR)
JO KYOUNGWOO (KR)
KIM MANGEUN (KR)
HAM SEUNGWOO (KR)
JO KYOUNGWOO (KR)
KIM MANGEUN (KR)
HAM SEUNGWOO (KR)
Application Number:
PCT/KR2016/009396
Publication Date:
December 07, 2017
Filing Date:
August 24, 2016
Export Citation:
Assignee:
LG ELECTRONICS INC (KR)
International Classes:
G01J5/20; G01J5/06; G01J5/08; G01J5/28
Foreign References:
| KR20140071596A | 2014-06-12 | |||
| US20120187079A1 | 2012-07-26 | |||
| KR20120089342A | 2012-08-09 | |||
| KR20090096196A | 2009-09-10 | |||
| KR20140042633A | 2014-04-07 |
Attorney, Agent or Firm:
KIM, Ki Moon (KR)
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