Title:
ORTHOPEDIC IMPLANT, STRAIN MONITORING SYSTEM, PROCESSING METHOD AND DEVICE, AND MEDIUM
Document Type and Number:
WIPO Patent Application WO/2024/094188
Kind Code:
A1
Abstract:
The present invention relates to the technical field of medical instruments, and in particular, to an orthopedic implant, a strain monitoring system, a processing method and device, and a medium. The orthopedic implant comprises: an orthopedic implant body with biocompatibility; a radio frequency label circuit formed by in situ carbonization at a target position on the surface of the orthopedic implant body; and an encapsulation body with biocompatibility encapsulating the surface of the label circuit. Therefore, according to the present invention, positions with higher stress or positions prone to failure of a human bone anatomical structure can be acquired by biomechanical finite element simulation of the human bone anatomical structure, so as to produce sensing circuits in situ in a specific area by means of multi-degree-of-freedom laser processing, thereby endowing the orthopedic implant body with sensing and communication capabilities. Also, multi-degree-of-freedom processing is required for achieving attachment machining, and the machining path is determined on a target curved surface of the orthopedic implant body, so as to ensure that the laser optical axis is perpendicular to the curved surface in real time, and the iso-defocusing and uniform-speed scanning of lasers are achieved, thereby improving the machining efficiency.
Inventors:
ZANG XINING (CN)
ZHAO ZHE (CN)
HUANG JINCAI (CN)
LI QINGANG (CN)
HE YIWEI (CN)
ZHAO ZHE (CN)
HUANG JINCAI (CN)
LI QINGANG (CN)
HE YIWEI (CN)
Application Number:
PCT/CN2023/129698
Publication Date:
May 10, 2024
Filing Date:
November 03, 2023
Export Citation:
Assignee:
UNIV TSINGHUA (CN)
International Classes:
A61B17/70; A61B5/00; A61F2/02
Domestic Patent References:
| WO2022195165A1 | 2022-09-22 |
Foreign References:
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Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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