PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION

Title:

PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2002/046840

Kind Code:

A1

Abstract:

A photocurable and thermosetting resin composition comprising (A) an actinic radiation curable resin bearing one or more structures represented by the general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component: (1) wherein R?1¿ is hydrogen or C¿1-6? alkyl; R?2¿, R?3¿, and R?4¿ are each hydrogen, C¿1-6? alkyl, aryl, aralkyl, cyano, fluoro, or furyl; and X is a polybasic acid anhydride residue.

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Inventors:

NISHIKUBO TADATOMI (JP)
KAMEYAMA ATSUSHI (JP)
SASAKI MASAKI (JP)
KUSAMA MASATOSHI (JP)

Application Number:

PCT/JP2001/010329

Publication Date:

June 13, 2002

Filing Date:

November 27, 2001

Export Citation:

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Assignee:

UNIV KANAGAWA (JP)
TAIYO INK MFG CO LTD (JP)
NISHIKUBO TADATOMI (JP)
KAMEYAMA ATSUSHI (JP)
SASAKI MASAKI (JP)
KUSAMA MASATOSHI (JP)

International Classes:

C08F2/44; C08F2/50; C08F20/28; C08F283/10; C08F290/02; C08F290/06; C08G65/18; C08G65/332; C08L63/00; C08L101/00; G03F7/027; G03F7/032; G03F7/038; C08L71/00; (IPC1-7): G03F7/038; G03F7/027; C08F20/28; C08F290/06

Domestic Patent References:

WO1997016470A1

1997-05-09

Foreign References:

EP1035439A2

2000-09-13

Other References: