Title:
PHOTODETECTOR AND RANGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048267
Kind Code:
A1
Abstract:
A photodetector comprising: a first semiconductor substrate having a first surface and a second surface opposing each other and a pixel array section in which a plurality of pixels is arranged in an array; a light receiving section that is provided inside the first semiconductor substrate for each pixel and generates carriers through photoelectric conversion according to the amount of light received; a multiplier section that is provided on the first surface for each pixel and avalanche multiplies the carriers generated in the light receiving section; an insulating layer laminated on the first surface and having one or a plurality of openings at predetermined positions; one or a plurality of polysilicon films that is provided along the boundary of adjacent pixels on the first surface side with the insulating layer interposed therebetween and that is electrically connected to the light receiving section through the one or the plurality of openings; one or a plurality of first wirings provided along the outer shape of the pixels on the first surface side; and one or a plurality of first connection wirings that is provided along the outer shape of the pixels on the first surface side and electrically connects the one or the plurality of polysilicon films and the one or the plurality of first wirings.
Inventors:
TSUGAWA HIDENOBU (JP)
NAKAMURA RYOICHI (JP)
NAKAMURA RYOICHI (JP)
Application Number:
PCT/JP2023/029493
Publication Date:
March 07, 2024
Filing Date:
August 15, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; G01C3/06; G01S7/4863; G01S7/4914; H01L31/107
Domestic Patent References:
| WO2022065131A1 | 2022-03-31 | |||
| WO2021166689A1 | 2021-08-26 | |||
| WO2022014364A1 | 2022-01-20 | |||
| WO2022149467A1 | 2022-07-14 |
Foreign References:
| JP2018088488A | 2018-06-07 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: