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Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND WIRELESS COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048266
Kind Code:
A1
Abstract:
This semiconductor device comprises: a substrate; a channel layer that is provided on one surface side of the substrate, and that contains a first nitride semiconductor having a first band gap; a barrier layer that is provided on the substrate on the opposite side of the channel layer, and that contains a second nitride semiconductor formed of Alx1Iny1Ga(1-x1-y1)N (0

Inventors:
TASAI KUNIHIKO (JP)
Application Number:
PCT/JP2023/029492
Publication Date:
March 07, 2024
Filing Date:
August 15, 2023
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Assignee:
SONY GROUP CORP (JP)
International Classes:
H01L29/778; H01L21/338; H01L29/812
Domestic Patent References:
WO2022049983A12022-03-10
Foreign References:
JP2018056299A2018-04-05
JP2007250991A2007-09-27
JP2016225578A2016-12-28
JP2018195665A2018-12-06
JP2019525499A2019-09-05
JP2021526308A2021-09-30
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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