Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/002071
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which exhibits excellent insulation reliability and has physical properties suitable for a buildup layer (interlayer insulating layer) of a multilayer printed wiring board, while having photosensitivity. This photosensitive resin composition contains (A) an epoxy resin, (B) one or more curing agents that are selected from the group consisting of active ester curing agents, cyanate ester curing agents and benzoxazine curing agents, and (C) a compound having a (meth)acrylate structure.
Inventors:
YODA MASANORI (JP)
NAKAMURA SHIGEO (JP)
NAKAMURA SHIGEO (JP)
Application Number:
PCT/JP2014/067067
Publication Date:
January 08, 2015
Filing Date:
June 26, 2014
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
G03F7/032; C08F290/00; C08G59/40; G03F7/004; G03F7/027; H05K3/28; H05K3/46
Domestic Patent References:
| WO2010026927A1 | 2010-03-11 |
Foreign References:
| JP2007003807A | 2007-01-11 | |||
| JP2006343384A | 2006-12-21 | |||
| JPS56141321A | 1981-11-05 | |||
| JPH10142797A | 1998-05-29 | |||
| JP2002357896A | 2002-12-13 | |||
| JP2004189976A | 2004-07-08 | |||
| JP2001330951A | 2001-11-30 | |||
| JP2006028498A | 2006-02-02 | |||
| JP2011089038A | 2011-05-06 | |||
| JP2009010057A | 2009-01-15 |
Attorney, Agent or Firm:
SAKAI, Hiroaki et al. (JP)
Hiroaki Sakai (JP)
Hiroaki Sakai (JP)
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