Title:
THIN-SLICE MANUFACTURING DEVICE AND THIN-SLICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/002070
Kind Code:
A1
Abstract:
A thin-slice manufacturing device (1) for cutting a thin slice by cutting an embedded block (B), in which a biological sample (S) is embedded in paraffin (P), by using a cutting blade (3) which moves along an imaginary plane (H) relative to the embedded block (B), the thin-slice manufacturing device (1) being equipped with an epi-illumination unit (4) for irradiating the embedded block (B) with light, and a tilt estimation unit (54) for detecting the border line between a non-cutting plane and the cutting plane along the imaginary plane (H) which is cut, on the basis of the reflection of light produced by the light which the epi-illumination unit (4) emits onto the embedded block (B), and estimating tilt information expressing information pertaining to the tilt of the embedded block (B), on the basis of the detected border line.
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Inventors:
MIYATANI TATSUYA (JP)
Application Number:
PCT/JP2014/067064
Publication Date:
January 08, 2015
Filing Date:
June 26, 2014
Export Citation:
Assignee:
SAKURA FINETEK JAPAN CO LTD (JP)
International Classes:
G01N1/06
Domestic Patent References:
| WO2012147730A1 | 2012-11-01 |
Foreign References:
| JP2008020293A | 2008-01-31 | |||
| JP2007212387A | 2007-08-23 | |||
| JP2007218616A | 2007-08-30 | |||
| JP2008076251A | 2008-04-03 | |||
| JP2007212276A | 2007-08-23 | |||
| JP2002539424A | 2002-11-19 | |||
| JP2002539424A | 2002-11-19 | |||
| JP4840765B2 | 2011-12-21 |
Other References:
See also references of EP 3018465A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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