Title:
PLASMA PROCESSING DEVICE, ANALYSIS DEVICE, AND ANALYSIS PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/176534
Kind Code:
A9
Abstract:
Provided are a plasma processing device, an analysis device, and an analysis program by which plasma processing can be stabilized. In a plasma processing device according to an aspect, each of a first high frequency power supply and a second high frequency power supply generates a pulse, and plasma processing is performed while the load-side impedance of the second high frequency power supply is controlled by a matcher, the plasma processing device comprising: a calculation unit that acquires corresponding reflected wave powers when the first high frequency power supply has generated continuous pulses and the second high frequency power supply has generated intermittent pulses under different setting parameters, and that calculates index values indicating the states of the reflected waves; and a determination unit that, on the basis of variations in each of the calculated index values, determines a setting parameter that is designated in the first high frequency power supply and the second high frequency power supply, and also derives a range that is excluded from the object of calculation when an index value that is used for controlling the matcher is calculated.
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Inventors:
KANEKO KAZUSHI (JP)
ISHIDA YOHEI (JP)
ISHIDA YOHEI (JP)
Application Number:
PCT/JP2023/008220
Publication Date:
December 21, 2023
Filing Date:
March 06, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; H01L21/3065
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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