Title:
POLISHING BODY FOR CMP POLISHING, CMP POLISHING APPARATUS, CMP POLISHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2004/105113
Kind Code:
A1
Abstract:
A polishing body for CMP polishing is disclosed which is preferably used in a CMP polishing method which enables to prevent excess polishing of the peripheral surface of a wafer. This polishing body for CMP polishing is composed of a polishing pad, a hard elastic member and a soft elastic member bonded together in this order, and the thickness of the soft elastic member is not more than a half of the thickness of the polishing pad.
Inventors:
HOSHINO SUSUMU (JP)
YOSHIDA NORIO (JP)
KITADE YUKO (JP)
SHIMODA OSAMU (JP)
YABUKI TAKEYA (JP)
YOSHIDA NORIO (JP)
KITADE YUKO (JP)
SHIMODA OSAMU (JP)
YABUKI TAKEYA (JP)
Application Number:
PCT/JP2004/006859
Publication Date:
December 02, 2004
Filing Date:
May 14, 2004
Export Citation:
Assignee:
NIKON CORP (JP)
HOSHINO SUSUMU (JP)
YOSHIDA NORIO (JP)
KITADE YUKO (JP)
SHIMODA OSAMU (JP)
YABUKI TAKEYA (JP)
HOSHINO SUSUMU (JP)
YOSHIDA NORIO (JP)
KITADE YUKO (JP)
SHIMODA OSAMU (JP)
YABUKI TAKEYA (JP)
International Classes:
B24B37/24; B24D13/14; (IPC1-7): H01L21/304; B24B37/00
Foreign References:
| JPH083540A | 1996-01-09 | |||
| JPH07164308A | 1995-06-27 | |||
| JPH0677185A | 1994-03-18 |
Attorney, Agent or Firm:
Hosoe, Toshiaki (3-6 NIshikanagawa 1-Chome, Kanagawa-k, Yokohama-Shi Kanagawa 22, JP)
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