Title:
PRODUCTION OF AN OPTOELECTRONIC COMPONENT THAT IS ENCAPSULATED IN PLASTIC, AND CORRESPONDING METHODS
Document Type and Number:
WIPO Patent Application WO/2004/105117
Kind Code:
A2
Abstract:
The invention relates to a simplified method for assembling optoelectronic components that are enclosed in plastic and the construction thereof. The individual component unit contains a semiconductor chip (11) and an optical window (10). A hermetic inclusion of at least the optically active areas of the semiconductor chip via the window ensues in the wafer-slicing process, i.e. before separation. A (window) wafer provided with recesses (7) and occupied, in areas, by a joining layer is joined to the pre-prepared semiconductor wafer (1) via the joining layer that seals the optically active areas. Before separation, the contact areas and the separating areas of the separation are exposed by a severing (8) that is precise with regard to the recesses. An inspection measuring of the component units can ensue when the wafers are joined.
Inventors:
BUETTNER SIEGFRIED (DE)
KNECHTEL ROY (DE)
KNECHTEL ROY (DE)
Application Number:
PCT/DE2004/001045
Publication Date:
December 02, 2004
Filing Date:
May 19, 2004
Export Citation:
Assignee:
X FAB SEMICONDUCTOR FOUNDRIES (DE)
BUETTNER SIEGFRIED (DE)
KNECHTEL ROY (DE)
BUETTNER SIEGFRIED (DE)
KNECHTEL ROY (DE)
International Classes:
H01L21/50; H01L21/58; H01L27/14; H01L31/0203; H01L31/0232; H01L33/00; (IPC1-7): H01L21/50
Foreign References:
| US6503780B1 | 2003-01-07 | |||
| DE4319786A1 | 1993-12-23 | |||
| US5773323A | 1998-06-30 | |||
| EP0609062A1 | 1994-08-03 | |||
| US20020027296A1 | 2002-03-07 | |||
| US20020001869A1 | 2002-01-03 | |||
| US6268654B1 | 2001-07-31 | |||
| EP0682374A1 | 1995-11-15 |
Other References:
PATENT ABSTRACTS OF JAPAN Bd. 2000, Nr. 24, 11. Mai 2001 (2001-05-11) -& JP 2001 203174 A (DENSO CORP), 27. Juli 2001 (2001-07-27)
Attorney, Agent or Firm:
Leonhard, Olgemoeller Fricke (Muenchen, DE)
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