Title:
POLYAMIDE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/120457
Kind Code:
A1
Abstract:
The present invention provides a polyamide composition which exhibits excellent heat resistance and excellent chemical resistance, while having high moldability. This polyamide composition contains a polyamide (A) which contains a diamine unit (X) and a dicarboxylic acid unit (Y), and an organic thermal stabilizer (B); the diamine unit (X) contains not less than 0.1% by mole but less than 36% by mole of a diamine unit (X1); and the diamine unit (X1) is a constituent unit that is derived from an aliphatic diamine which has 6 to 10 carbon atoms, wherein if a carbon atom to which an arbitrary one of the amino groups is bonded is taken to be in the 1-position, an alkyl group having 2 or 3 carbon atoms is bonded to the carbon atom in the 2-position.
Inventors:
SUGAI NAOTO (JP)
NANYA ATSUSHI (JP)
NANYA ATSUSHI (JP)
Application Number:
PCT/JP2022/046617
Publication Date:
June 29, 2023
Filing Date:
December 19, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L77/06; C08G69/02; C08K5/13
Domestic Patent References:
| WO2020040282A1 | 2020-02-27 | |||
| WO2022091987A1 | 2022-05-05 |
Foreign References:
| CN101307218A | 2008-11-19 | |||
| JP2008275674A | 2008-11-13 | |||
| JPS5241692A | 1977-03-31 | |||
| JPH03140327A | 1991-06-14 | |||
| JP2021038370A | 2021-03-11 | |||
| JP2022030403A | 2022-02-18 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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