Title:
POLYAMIDE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/120458
Kind Code:
A1
Abstract:
The present invention provides a polyamide composition that has high moldability, excellent heat resistance, high mechanical strength, and low anisotropy. Provided is a polyamide composition comprising a polyamide (A) and an inorganic filler (B), wherein: the polyamide (A) includes a diamine unit (X) and a dicarboxylic acid unit (Y); the diamine unit (X) contains not less than 0.1 mol% but less than 36 mol% of a diamine unit (X1); the diamine unit (X1) is a structural unit derived from an aliphatic diamine in which, when position 1 is defined as a carbon atom to which an arbitrary amino group is bonded, an alkyl group having a carbon number of 2 or 3 is bonded to the carbon atom at position 2, and the carbon number thereof is 6-10; and the aspect ratio of the inorganic filler (B) in the polyamide composition is 1-22.
Inventors:
ITOI YUICHI (JP)
TAKEDA HIDEAKI (JP)
NANYA ATSUSHI (JP)
TAKEDA HIDEAKI (JP)
NANYA ATSUSHI (JP)
Application Number:
PCT/JP2022/046618
Publication Date:
June 29, 2023
Filing Date:
December 19, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08L77/06; C08G69/02; C08K3/013; C08K7/02
Domestic Patent References:
| WO2020040282A1 | 2020-02-27 | |||
| WO2020175389A1 | 2020-09-03 | |||
| WO2022091987A1 | 2022-05-05 |
Foreign References:
| JPH03140327A | 1991-06-14 | |||
| JPS5241692A | 1977-03-31 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF: