Title:
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/087072
Kind Code:
A2
Abstract:
A printed circuit board, according to one embodiment, comprises: an insulation layer; at least one circuit pattern or pad which is formed on the insulation layer; a solder resist having an open portion for exposing the upper surface of the pad and is formed on the insulation layer; and a bump which is formed on the pad that is exposed through the open portion of the solder resist and has lower surface area that is smaller than the upper surface area of the pad.
Inventors:
RYU SUNG WUK (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
Application Number:
PCT/KR2011/010057
Publication Date:
June 28, 2012
Filing Date:
December 23, 2011
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
RYU SUNG WUK (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
RYU SUNG WUK (KR)
SHIM SEONG BO (KR)
SHIN SEUNG YUL (KR)
International Classes:
H05K3/40; H05K3/28
Domestic Patent References:
| WO2010046235A1 | 2010-04-29 |
Foreign References:
| JP2004079839A | 2004-03-11 | |||
| JP2006173654A | 2006-06-29 | |||
| JP2001077140A | 2001-03-23 |
Other References:
None
See also references of EP 2645829A4
See also references of EP 2645829A4
Attorney, Agent or Firm:
SEO, Kyo Jun (KR)
서교준 (KR)
서교준 (KR)
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Claims: