Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/013213
Kind Code:
A1
Abstract:
This printed wiring board comprises a base film that has a first main surface including a groove and wiring that is disposed in the groove. The wiring has at least a metal particle layer that is disposed on the bottom surface of the groove and a plating layer that is disposed on the metal particle layer. The metal particle layer contains a plurality of metal particles that are bonded to each other by metallic bonding. The surface of each of the plurality of metal particles is partially covered with an organic layer.
Inventors:
YAMAMOTO MASAMICHI (JP)
HASHIZUME KAYO (JP)
OKADA ISSEI (JP)
AIKAWA KENICHIRO (JP)
OKA YOSHIO (JP)
HASHIZUME KAYO (JP)
OKADA ISSEI (JP)
AIKAWA KENICHIRO (JP)
OKA YOSHIO (JP)
Application Number:
PCT/JP2022/021565
Publication Date:
February 09, 2023
Filing Date:
May 26, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/18
Foreign References:
| JP2012244009A | 2012-12-10 | |||
| JPS62243390A | 1987-10-23 | |||
| JP2009081209A | 2009-04-16 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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