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Title:
RESIN COMPOSITION AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2020/066969
Kind Code:
A1
Abstract:
Provided is a resin composition characterized by containing component (A) , component (B), and component (C) below, wherein the content of component (B) with respect to 100 parts by mass of component (A)is 35-80 parts by mass, and the content of component (C) with respect to 100 parts by mass of component (A) is 25-35 parts by mass. Component (A): a crystalline thermoplastic resin having a melting point or a flow starting temperature of 300 °C or higher; component (B): a carbon fiber having a number average fiber length of 120-300 μm and a number average fiber diameter of 2-10 μm; and component (C): at least one inorganic filler selected from among a plate-like filler, a scale-like filler, and a granular filler.

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Inventors:
SAKAI TAIGA (JP)
Application Number:
PCT/JP2019/037180
Publication Date:
April 02, 2020
Filing Date:
September 24, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/12; C08K3/013; C08K7/06; C08L67/03; C08L71/10
Foreign References:
JP2006511644A2006-04-06
JP2006515638A2006-06-01
JPH01242662A1989-09-27
JPH0848887A1996-02-20
JPH0881629A1996-03-26
JP2007192242A2007-08-02
JPH06172619A1994-06-21
JPH02218753A1990-08-31
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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