RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION AND OPTICAL SEMICONDUCTOR DEVICE PRODUCED BY USING SAME

WIPO Patent Application WO/2007/040107

A1

Disclosed is an epoxy resin composition for optical semiconductor device encapsulation, which contains an epoxy resin (component A) mainly containing an epoxy compound represented by a specific structural formula (1), a curing agent (component B), and at least one of an oxynitride phosphor and a nitride phosphor (component C). The phosphor component (component C) is uniformly dispersed in the epoxy resin composition without segregation, and thus the epoxy resin composition serves as a material for optical semiconductor device encapsulation which has adequate light diffusion property and high light transmittance while being reduced in internal stress. A light-emitting diode device encapsulated by using such an epoxy resin composition is capable of emitting light stably, and thus performs its function sufficiently.

ITO HISATAKA (JP)
USUI HIDEYUKI (JP)
HIROSAKI NAOTO (JP)

PCT/JP2006/319116

April 12, 2007

September 27, 2006

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NITTO DENKO CORP (JP)
NAT INST FOR MATERIALS SCIENCE (JP)
ITO HISATAKA (JP)
USUI HIDEYUKI (JP)
HIROSAKI NAOTO (JP)

C08L63/00; C08G59/32; C08K3/28; H01L23/29; H01L23/31; H01L33/50; H01L33/56

WO2003091338A1

2003-11-06

JP2002324920A	2002-11-08
JP2004528472A	2004-09-16
JP2001261933A	2001-09-26
JP2004134805A	2004-04-30
JP2004103814A	2004-04-02
JP2003046141A	2003-02-14
JP2002363554A	2002-12-18
JP2001214162A	2001-08-07
JP2001148516A	2001-05-29
JP2006193570A	2006-07-27

SAITOH, Yukihiko et al. (2-7 Minamimorimachi 2-chom, Kita-ku Osaka-shi Osaka54, JP)

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