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Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/034099
Kind Code:
A1
Abstract:
The present application may provide a resin composition which comprises a thermally conductive filler capable of exhibiting desired thermal conductivity and which, when injected by equipment such as nozzles, can improve or minimize a load applied to injection equipment.

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Inventors:
YANG YOUNG JO (KR)
PARK EUN SUK (KR)
PARK HYOUNG SOOK (KR)
KANG YANG GU (KR)
LEE JEONG HYUN (KR)
Application Number:
PCT/KR2020/011031
Publication Date:
February 25, 2021
Filing Date:
August 19, 2020
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08K3/013; C08G18/42; C08L75/06; H01M10/625; H01M10/653
Foreign References:
KR20180125824A2018-11-26
KR20110065423A2011-06-15
JP2012107153A2012-06-07
KR20190084223A2019-07-16
KR20180108768A2018-10-04
KR20190100983A2019-08-30
KR20160105354A2016-09-06
Other References:
See also references of EP 4006090A4
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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