Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/157542
Kind Code:
A1
Abstract:
Provided is a resin composition capable of giving cured objects which, even in semiconductor chip packages which are, for example, enlarged ones, are inhibited from cracking or causing delamination and from warping. The resin composition comprises (A) an epoxy resin and (B) an inorganic filler. When an SS curve is drawn in which the strain (%) of a cured object formed by thermally curing the resin composition at 150°C for 60 minutes has been plotted as X axis and the bending strength (MPa) of the cured object formed by thermally curing the resin composition at 150°C for 60 minutes has been plotted as Y axis and when a triangle in which one side is a perpendicular drawn from a point where the bending strength is maximum to the X axis and another side is a straight line extending from the intersection of the perpendicular and the X axis to the intersection of the X axis and the Y axis is formed, then the toughness shown by the area of the triangle exceeds 30 MPa. The (B) component has a carbon content per unit surface area of 0.35 mg/m2 or higher.
Inventors:
SAKAUCHI HIROYUKI (JP)
SASAKI MINORU (JP)
SASAKI MINORU (JP)
Application Number:
PCT/JP2023/001361
Publication Date:
August 24, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
C08L63/00; C08G59/40; C08K9/06; H01L21/52
Foreign References:
| JP2011089038A | 2011-05-06 | |||
| JP2007262126A | 2007-10-11 | |||
| JP2016121294A | 2016-07-07 | |||
| JP2006052357A | 2006-02-23 | |||
| JP2021161206A | 2021-10-11 | |||
| JP2019014843A | 2019-01-31 | |||
| JP2006036916A | 2006-02-09 | |||
| JP2011168650A | 2011-09-01 | |||
| JP2017048400A | 2017-03-09 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
Download PDF: