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Title:
SEALANT FILM
Document Type and Number:
WIPO Patent Application WO/2023/074754
Kind Code:
A1
Abstract:
[Problem] To provide a sealant film which, when heat-sealed at low temperatures, can attain sufficient heat seal strength. [Solution] A sealant film for laminating to bases, the sealant film being a single-layer film comprising a polyethylene resin layer (1) having a density of 0.920 g/cm3 or less.

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JPH10156928BOTTLE BODY OF SYNTHETIC RESIN
JPH07214706MULTI-LAYER HOLLOW-MOLDED CONTAINER PROVIDED WITH HIGH-GLOSS, HIGH IMPACT RESISTANCE AND EXCELLENT STRESS CRACKING RESISTANCE
Inventors:
YAMADA KENICHI (JP)
ASANO KAEKO (JP)
TAKASUGI YUYA (JP)
Application Number:
PCT/JP2022/039987
Publication Date:
May 04, 2023
Filing Date:
October 26, 2022
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B1/02; C09K3/10; B32B27/00; B32B27/20; B32B27/32
Domestic Patent References:
WO2017018479A12017-02-02
Foreign References:
JPS63309440A1988-12-16
JP2019064743A2019-04-25
JP2001233351A2001-08-28
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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