Title:
SEMICONDUCTOR DEVICE AND ELECTRONIC INSTRUMENT
Document Type and Number:
WIPO Patent Application WO/2014/050694
Kind Code:
A1
Abstract:
The present invention relates to a semiconductor device and an electronic instrument capable of maintaining reliability of very fine transistors while improving output characteristics of a signal in a device configured of stacked semiconductor substrates. The present invention is provided with a first semiconductor substrate, a second semiconductor substrate for providing a different function than the function provided by the first semiconductor substrate, and a dispersion-preventing film for preventing dispersion of dangling-bond terminal atoms used to reduce the interface state between the first semiconductor substrate and the second semiconductor substrate, at least two semiconductor substrates being stacked, the semiconductor substrates being electrically connected, the first semiconductor substrate and the second semiconductor substrate being stacked in a state in which the dispersion-preventing film is inserted between a boundary surface of the first semiconductor substrate and a boundary surface of the second semiconductor substrate.
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Inventors:
BABA KOICHI (JP)
KUBODERA TAKASHI (JP)
MIYAZAKI TOSHIHIKO (JP)
AMMO HIROAKI (JP)
KUBODERA TAKASHI (JP)
MIYAZAKI TOSHIHIKO (JP)
AMMO HIROAKI (JP)
Application Number:
PCT/JP2013/075293
Publication Date:
April 03, 2014
Filing Date:
September 19, 2013
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L27/146; H01L27/14
Foreign References:
| JPH09293698A | 1997-11-11 | |||
| JP2011119543A | 2011-06-16 | |||
| JP2009188068A | 2009-08-20 |
Attorney, Agent or Firm:
INAMOTO Yoshio et al. (JP)
Yoshio Inemoto (JP)
Yoshio Inemoto (JP)
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