Title:
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/241447
Kind Code:
A1
Abstract:
A semiconductor device is provided with an insulation layer, a semiconductor element, a wiring layer, and a sealing resin. The insulation layer has a main surface and a reverse surface set away from each other in the thickness direction, and has formed therein a penetration part extending in the thickness direction. The semiconductor element has an electrode corresponding to the penetration part and is in contact with the main surface. The wiring part includes a linking part that is housed in the penetration part and is in contact with the electrode, and a main part that is continuous from the linking part and that is positioned on the reverse surface. The sealing resin is in contact with the main surface and covers the semiconductor element. The electrode has a connection surface facing the linking part. The connection surface includes a first region that is exposed from the insulation layer by the penetration part, and a second region in contact with the insulation layer. The surface roughness of the first region is higher than the surface roughness of the second region.
Inventors:
FUJI KAZUNORI (JP)
WU XIAOPENG (JP)
WU XIAOPENG (JP)
Application Number:
PCT/JP2021/019392
Publication Date:
December 02, 2021
Filing Date:
May 21, 2021
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/12; H01L21/56
Domestic Patent References:
| WO2018047770A1 | 2018-03-15 |
Foreign References:
| JP2008294415A | 2008-12-04 | |||
| JP2009177072A | 2009-08-06 | |||
| JP2018019071A | 2018-02-01 | |||
| JP2017069257A | 2017-04-06 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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