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Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2013/047607
Kind Code:
A1
Abstract:
This semiconductor module is provided with a first substrate having a power combiner formed on a first main surface, and a second substrate having formed thereon a communication integrated circuit electrically connected to the power combiner. On the first main surface side of the first substrate, the second substrate is disposed in a region that overlaps the first substrate.

Inventors:
UEMICHI YUSUKE (JP)
Application Number:
PCT/JP2012/074758
Publication Date:
April 04, 2013
Filing Date:
September 26, 2012
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Assignee:
FUJIKURA LTD (JP)
International Classes:
H04B1/04; H01L23/12; H01L25/00; H03F3/68
Domestic Patent References:
WO2005062416A12005-07-07
Foreign References:
JP2011135361A2011-07-07
JP2006319794A2006-11-24
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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