MOLDED RESIN BODY FOR SURFACE-MOUNTED LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE

WIPO Patent Application WO/2013/047606

A1

This molded resin body for a surface-mounted light-emitting device comprises a cured resin body integrally formed with multiple leads and has a recessed section where the multiple leads are exposed at the bottom. The open face of the recessed section has a ten-point mean roughness (Rz) of 1µm-10µm, the cured resin body has a glass transition temperature equal to or higher than 10°C, and the glass transition temperature is a value which is measured by using a thermo-mechanical analyzer (TMA) under the conditions of a temperature range of -50 to 250°C, a heating rate of 5°C/min, and a specimen length of 1-5mm. The open face of the recessed section has an optical reflectance equal to or higher than 80% at 460nm, and the retention rate of the optical reflectance after the molded resin body is heated at 180˚C for seventy-two hours is equal to or higher than 90%.

TOZAWA TOMOKAZU (JP)
IWAHARA TAKAHISA (JP)
OGOSHI HIROSHI (JP)
HIRABAYASHI KAZUHIKO (JP)
OZAKI SHUHEI (JP)
IBA SATOAKI (JP)
KANAI KAZUAKI (JP)
KAKEHASHI YASUSHI (JP)
MANABE TAKAO (JP)
HORI MITSUHIRO (JP)
NARITA RYOICHI (JP)

PCT/JP2012/074757

April 04, 2013

September 26, 2012

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KANEKA CORP (JP)

H01L33/60; B29C45/02; C08G77/04; C08L83/05

JP2009155415A	2009-07-16
JP2008162016A	2008-07-17
JPS63107532A	1988-05-12
JPS61269338A	1986-11-28
JP2004152952A	2004-05-27
JP2003282948A	2003-10-03
JP2005146191A	2005-06-09
JP2008091818A	2008-04-17

YANAGINO Takao et al. (JP)
Takao Yanagino (JP)

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