Title:
SEMICONDUCTOR RELAY AND SEMICONDUCTOR RELAY MODULE PROVIDED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2023/189918
Kind Code:
A1
Abstract:
A semiconductor relay 1 is provided with at least a housing 11, a first input terminal 6, a second input terminal 7, a first output terminal 8, a second output terminal 9, a light-emitting element 2, a light receiving element 51, a first MOSFET 3, and a second MOSFET 4. The light-emitting element 2 is disposed to a first main surface 7d1 of a first substrate 7d, and a light-receiving drive element 5 is disposed to a second main surface 10a of a second substrate 10. A source electrode 5a of the light-receiving drive element 5 and the second substrate 10 are connected to the same potential. The second substrate 10 is disposed between the first MOSFET 3 and the second MOSFET 4 when viewed along the first axis. The normal of the first main surface 7d1 of the first substrate 7d intersects the normal of the second main surface 10a of the second substrate 10.
Inventors:
KURIAKI TOMONARI
KITAHARA DAISUKE
TSUNEOKA MICHIAKI
KAJIMOTO YOSHIYUKI
KITAHARA DAISUKE
TSUNEOKA MICHIAKI
KAJIMOTO YOSHIYUKI
Application Number:
PCT/JP2023/011155
Publication Date:
October 05, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L31/12; H03K17/78
Foreign References:
| JP2011082916A | 2011-04-21 | |||
| JPS55169875U | 1980-12-05 | |||
| US20090140266A1 | 2009-06-04 | |||
| JP2009152301A | 2009-07-09 | |||
| JP2015056504A | 2015-03-23 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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