Title:
SILVER PASTE FOR FLEXIBLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/051830
Kind Code:
A1
Abstract:
Provided is a silver paste for a flexible substrate for which an electrically conductive film having good adhesiveness can be formed on a flexible substrate having low heat resistance. The silver paste for a flexible substrate contains: (A) a silver powder; (B) a thermoplastic polyester resin as a binder; and (C) a solvent by which to dissolve the thermoplastic polyester resin. The silver powder (A) has a mean particle diameter of 40-100 nm. The thermoplastic polyester resin (B) has a glass transition point of 60-90°C, and is contained at a ratio of 5-8 parts by mass to 100 parts by mass of silver powder. The solvent (C) has a boiling point of 180-250°C, and contains a phenyl group in the molecular structure.
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Inventors:
NAKAYAMA KAZUTAKA (JP)
SAKAI AKIHIRO (JP)
SUMIDA SAHOKO (JP)
SAKAI AKIHIRO (JP)
SUMIDA SAHOKO (JP)
Application Number:
PCT/JP2017/031811
Publication Date:
March 22, 2018
Filing Date:
September 04, 2017
Export Citation:
Assignee:
NORITAKE CO LTD (JP)
International Classes:
H01B1/22; H01B1/00; H01B5/14; H01B13/00; H05K1/09
Domestic Patent References:
| WO2016063931A1 | 2016-04-28 | |||
| WO2014112683A1 | 2014-07-24 |
Foreign References:
| JPH10162646A | 1998-06-19 | |||
| JP2013070056A | 2013-04-18 | |||
| JP2010135180A | 2010-06-17 | |||
| JP2009144197A | 2009-07-02 | |||
| JP2003203523A | 2003-07-18 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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